Internship Rffe Package Manufacturing Engineer, Sr. To Staff | (H272)
Job Description
Location field must contain city, state or a zip code to perform a radius search e.g., Denver, CO or 46122 . City and state must be separated by a comma followed by a space e.g., Houston, TX Qualcomm RFFE Package Manufacturing Engineer, Sr. to Staff Malaysia :Remote , Malaysia Apply NowQualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 5Gs potential into world:changing technologies and products. This is the Invention Age :and this is where you come in.General Summary:Member of RFFE Operation team managing and working with assembly/packaging subcontractor sites OSAT in Malaysia and Singapore.Seeking a highly motivated, independent individual with a broad knowledge of engineering principles in a fast:paced high:tech environment. Candidate must have a solid foundation in semiconductor packaging technologies and semiconductor assembly processes to cover various RFFE RF Front End packages or modules.Examples of responsibility areas:Production launch into high volume manufacturing HVMDevelop new process manufacturing BKMResolve manufacturing and customer quality issueDrive manufacturing yield and process innovation/cost reductionLead SAT operational excellence for reliable supply chain and customer demand supportProvide technical support to analyze the failures, improve product yield, and optimization continuously.Provide hands:on engineering partnering NPI team as on:site assembly/process expertSuggest and collaborate relevant cross functional departments Management, Project leaders, Packaging, Quality, Planning for the correction according to yield data/ analysis result and contribute in the areas of technical assessment, problem solutions, engineering disciplines, and execution to achieve results.Examples of advanced package technologies supported:FC QFN / FC LGARF/SiP moduleBumping / WLP OptionalOther Duties as needed:Industry benchmarking and competitive analysisCollaborate with internal teams ie R and D, NPI, quality, test, Design etc for many type of issue/projects.Interface with external assembly factory, material or equipment vendors to understand latest technologies.Project/case management; statistical analysis including DOE methodsMinimum Qualifications:Fluent Malay with proficiency in EnglishPermitted to work in Malaysia and need to travel within Asia or US on occasionMinimum of 5 to 10 years of hands:on process experience in assembly and packaging technology.Factory or manufacturing career OSAT or IDM preferredSupplier/Subcon management career preferredMust be strong written and oral communicatorWorking knowledge of:Package assembly processes and materialPackage reliability testing and failure modesIndustry packaging trends and customer considerationsEngineering tools FMEA/DOE/Trouble shootingQuality tools and reports SPC/PCN/8D/CARProcedure/requirements Qualification and ManufacturingJEDEC, IPC and other industry specificationsPreferred Qualifications:Excellent problem solving, debugging, documentation, presentation skills and proved experiencesGood engineering background with hands on experiences working with suppliers or customersSelf:motivated project management and good communication skillsManagement experience is a plusEducation Requirements:Required:Bachelor/Masters degree in Engineering, Information Systems, Computer Science, or related field.Applicants :If you need an accommodation, during the application/hiring process, you may request an accommodation by sending email to accommodationsupportTo all Staffing and Recruiting Agencies:Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals be
Kit Empleo
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